Table 1. 2.5D and 3D IC Packaging Consumption Value & CAGR: China VS Global, 2019-2030, US$ Million

Table 2. 2.5D and 3D IC Packaging Market Restraints

Table 3. 2.5D and 3D IC Packaging Market Trends

Table 4. 2.5D and 3D IC Packaging Industry Policy

Table 5. Global 2.5D and 3D IC Packaging Revenue by Company, 2019-2024, US$ million, Ranked Based on Revenue in 2022

Table 6. Global 2.5D and 3D IC Packaging Revenue Share by Company, 2019-2024, Ranked by Data of 2022

Table 7. Global 2.5D and 3D IC Packaging Manufacturers Market Concentration Ratio (CR3 and HHI)

Table 8. Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

Table 9. Global 2.5D and 3D IC Packaging Major Companies Product Type

Table 10. Head Office and Area Served of Key Players

Table 11. China 2.5D and 3D IC Packaging Revenue by Company, 2019-2024, US$ million, Ranked Based on Revenue in 2022

Table 12. China 2.5D and 3D IC Packaging Revenue Market Share by Company, 2019-2024

Table 13. Global Key Players of 2.5D and 3D IC Packaging Upstream (Raw Materials)

Table 14. Global 2.5D and 3D IC Packaging Typical Customers

Table 15. 2.5D and 3D IC Packaging Typical Distributors

Table 16. By Type, Global 2.5D and 3D IC Packaging Consumption Value & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 17. By Application, Global 2.5D and 3D IC Packaging Consumption Value & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 18. By Region, Global 2.5D and 3D IC Packaging Consumption Value, 2019 VS 2024 VS 2030, US$ Million

Table 19. By Region, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Table 20. By Country, Global 2.5D and 3D IC Packaging Consumption Value & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 21. By Country, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Table 22. By Country, Global 2.5D and 3D IC Packaging Consumption Value Market Share, 2019-2030

Table 23. ASE Technology Company Information, Head Office, Market Area and Industry Position

Table 24. ASE Technology Company Profile and Main Business

Table 25. ASE Technology 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 26. ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 27. ASE Technology Recent Developments

Table 28. Samsung Electronics Company Information, Head Office, Market Area and Industry Position

Table 29. Samsung Electronics Company Profile and Main Business

Table 30. Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 31. Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 32. Samsung Electronics Recent Developments

Table 33. Toshiba Company Information, Head Office, Market Area and Industry Position

Table 34. Toshiba Company Profile and Main Business

Table 35. Toshiba 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 36. Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 37. Toshiba Recent Developments

Table 38. STMicroelectronics Company Information, Head Office, Market Area and Industry Position

Table 39. STMicroelectronics Company Profile and Main Business

Table 40. STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 41. STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 42. STMicroelectronics Recent Developments

Table 43. Xilinx Company Information, Head Office, Market Area and Industry Position

Table 44. Xilinx Company Profile and Main Business

Table 45. Xilinx 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 46. Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 47. Xilinx Recent Developments

Table 48. Intel Company Information, Head Office, Market Area and Industry Position

Table 49. Intel Company Profile and Main Business

Table 50. Intel 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 51. Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 52. Intel Recent Developments

Table 53. Micron Technology Company Information, Head Office, Market Area and Industry Position

Table 54. Micron Technology Company Profile and Main Business

Table 55. Micron Technology 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 56. Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 57. Micron Technology Recent Developments

Table 58. TSMC Company Information, Head Office, Market Area and Industry Position

Table 59. TSMC Company Profile and Main Business

Table 60. TSMC 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 61. TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 62. TSMC Recent Developments

Table 63. SK Hynix Company Information, Head Office, Market Area and Industry Position

Table 64. SK Hynix Company Profile and Main Business

Table 65. SK Hynix 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 66. SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 67. SK Hynix Recent Developments

Table 68. Amkor Technology Company Information, Head Office, Market Area and Industry Position

Table 69. Amkor Technology Company Profile and Main Business

Table 70. Amkor Technology 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 71. Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 72. Amkor Technology Recent Developments

Table 73. GlobalFoundries Company Information, Head Office, Market Area and Industry Position

Table 74. GlobalFoundries Company Profile and Main Business

Table 75. GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 76. GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 77. GlobalFoundries Recent Developments

Table 78. SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

Table 79. SanDisk (Western Digital) Company Profile and Main Business

Table 80. SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 81. SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 82. SanDisk (Western Digital) Recent Developments

Table 83. Synopsys Company Information, Head Office, Market Area and Industry Position

Table 84. Synopsys Company Profile and Main Business

Table 85. Synopsys 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 86. Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 87. Synopsys Recent Developments

Table 88. Invensas Company Information, Head Office, Market Area and Industry Position

Table 89. Invensas Company Profile and Main Business

Table 90. Invensas 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 91. Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 92. Invensas Recent Developments

Table 93. Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

Table 94. Siliconware Precision Industries Company Profile and Main Business

Table 95. Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 96. Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 97. Siliconware Precision Industries Recent Developments

Table 98. Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

Table 99. Jiangsu Changjiang Electronics Company Profile and Main Business

Table 100. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 101. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 102. Jiangsu Changjiang Electronics Recent Developments

Table 103. Powertech Technology Company Information, Head Office, Market Area and Industry Position

Table 104. Powertech Technology Company Profile and Main Business

Table 105. Powertech Technology 2.5D and 3D IC Packaging Models, Specifications, and Application

Table 106. Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, US$ Million, 2019-2024

Table 107. Powertech Technology Recent Developments

List of Figures

Figure 1. 2.5D and 3D IC Packaging Picture

Figure 2. Global 2.5D and 3D IC Packaging Consumption Value, (US$ million) & (2019-2030)

Figure 3. China 2.5D and 3D IC Packaging Consumption Value, (US$ million) & (2019-2030)

Figure 4. By Consumption Value, China 2.5D and 3D IC Packaging Market Share of Global, 2019-2030

Figure 5. Global 2.5D and 3D IC Packaging Market Share by Company, (Tier 1, Tier 2, and Tier 3), 2022

Figure 6. China 2.5D and 3D IC Packaging Key Participants, Market Share, 2022

Figure 7. 2.5D and 3D IC Packaging Industry Chain

Figure 8. 2.5D and 3D IC Packaging Procurement Model

Figure 9. 2.5D and 3D IC Packaging Sales Model

Figure 10. 2.5D and 3D IC Packaging Sales Channels, Direct Sales, and Distribution

Figure 11. 2.5D

Figure 12. 3D TSV

Figure 13. 3D Wafer-level Chip-scale Packaging

Figure 14. By Type, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 15. By Type, Global 2.5D and 3D IC Packaging Consumption Value Market Share, 2019-2030

Figure 16. Consumer Electronics

Figure 17. Medical Devices

Figure 18. Communications and Telecom

Figure 19. Automotive

Figure 20. Other

Figure 21. By Application, Global 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 22. By Application, Global 2.5D and 3D IC Packaging Consumption Value Market Share, 2019-2030

Figure 23. By Region, Global 2.5D and 3D IC Packaging Consumption Value Market Share, 2019-2030

Figure 24. North America 2.5D and 3D IC Packaging Consumption Value & Forecasts, 2019-2030, US$ Million

Figure 25. By Country, North America 2.5D and 3D IC Packaging Consumption Value Market Share, 2022

Figure 26. Europe 2.5D and 3D IC Packaging Consumption Value & Forecasts, 2019-2030, US$ Million

Figure 27. By Country, Europe 2.5D and 3D IC Packaging Consumption Value Market Share, 2022

Figure 28. Asia Pacific 2.5D and 3D IC Packaging Consumption Value & Forecasts, 2019-2030, US$ Million

Figure 29. By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Consumption Value Market Share, 2022

Figure 30. South America 2.5D and 3D IC Packaging Consumption Value & Forecasts, 2019-2030, US$ Million

Figure 31. By Country, South America 2.5D and 3D IC Packaging Consumption Value Market Share, 2022

Figure 32. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value & Forecasts, 2019-2030, US$ Million

Figure 33. U.S. 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 34. By Type, U.S. 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 35. By Application, U.S. 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 36. Europe 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 37. By Type, Europe 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 38. By Application, Europe 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 39. China 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 40. By Type, China 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 41. By Application, China 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 42. Japan 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 43. By Type, Japan 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 44. By Application, Japan 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 45. South Korea 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 46. By Type, South Korea 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 47. By Application, South Korea 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 48. Southeast Asia 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 49. By Type, Southeast Asia 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 50. By Application, Southeast Asia 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 51. India 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 52. By Type, India 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 53. By Application, India 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 54. Middle East & Africa 2.5D and 3D IC Packaging Consumption Value, 2019-2030, US$ Million

Figure 55. By Type, Middle East & Africa 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 56. By Application, Middle East & Africa 2.5D and 3D IC Packaging Consumption Value Market Share, 2022 VS 2029

Figure 57. Research Methodology

Figure 58. Breakdown of Primary Interviews

Figure 59. Bottom-up and Top-down Approaches

Figure 60. Top-down Approaches