Global 2.5D and 3D IC Packaging Industry Research & Trends Analysis Report

2.5D and 3D IC Packaging Market by End User (Office Building Construction, Retail Construction, Hospitality Construction, Institutional Construction, Other End Users), by North America (United States, Canada, Mexico), by South America (Brazil, Argentina, Rest of South America), by Europe (United Kingdom, Germany, France, Italy, Spain, Russia, Benelux, Nordics, Rest of Europe), by Middle East & Africa (Turkey, Israel, GCC, North Africa, South Africa, Rest of Middle East & Africa), by Asia Pacific (China, India, Japan, South Korea, ASEAN, Oceania, Rest of Asia Pacific) Forecast 2024- is a comprehensive report that provides insights into the market dynamics, including the key drivers, challenges, and opportunities shaping the industry landscape. It also delves into the competitive landscape, highlighting the major players and their strategies.

ID : YHR269654 Category : Semiconductor & Electronics Pages : 150 Views : 93

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Ample Market Research presents an in-depth analysis of the 2.5D and 3D IC Packaging Market, offering valuable insights into current industry trends, future growth prospects, and strategic market dynamics. This report provides a detailed evaluation of key market drivers, restraints, emerging trends, and regional influences shaping the industry's evolution.

By leveraging historical analysis and forecast projections, this study offers a holistic understanding of market developments, assisting stakeholders in making informed strategic decisions. Additionally, a SWOT analysis is incorporated to highlight strengths, weaknesses, opportunities, and threats within the sector.

The evolving U.S. tariff policy in 2025 is bringing considerable uncertainty into the global economic landscape. This report delves into the latest U.S. tariff measures and the corresponding policy responses across the world, assessing their impacts on 2.5D and 3D IC Packaging market competitiveness, regional economic interdependencies, and supply chain reconfigurations.

2.5D and 3D IC Packaging Market Segmentation
Market segmentation in research is the process of breaking down a broad market into distinct consumer groups based on shared characteristics, such as demographics, geographic location, behavioral patterns, or lifestyle preferences. This approach enables businesses to refine their product offerings and marketing strategies to better address the unique needs of each segment. By tailoring their approach, companies can optimize resource allocation, enhance customer satisfaction, and drive sales growth, ultimately securing a competitive advantage. Effective segmentation helps businesses gain deeper insights into their audience, craft targeted strategies, and maximize overall market performance.

2.5D and 3D IC Packaging Market by Type [Analysis by Value from 2020 to ]:

2.5D Stacked
3D-IC
Hybrid Bonding
Fan-Out

2.5D and 3D IC Packaging Market by Application [Analysis by Value from 2020 to ]:

AI Chips
High-Performance Computing
Automotive Electronics
IoT

Key Players in the 2.5D and 3D IC Packaging Market
Leading market players are focused on strengthening their presence by acquiring emerging companies. Established firms are heavily investing in research and development to introduce innovative products and expand their market reach. Additionally, some companies are engaging in mergers to leverage their combined strengths and deliver high-quality products. Based on these factors, the study includes the following key industry players.

2.5D and 3D IC Packaging Market Dynamics: Drivers & Restraints
The report meticulously examines the core growth factors and challenges influencing market expansion. Each variable is supported by qualitative and quantitative insights, with Harvey ball indicators representing their level of impact.

2.5D and 3D IC Packaging Market Analysis & Industry Trends
A comprehensive overview of industry developments, regulatory updates, and structural market shifts is provided. The report also evaluates the impact of U.S. tariff policy on global demand fluctuations and recovery patterns.

2.5D and 3D IC Packaging Market Size & Demand Forecast ()
Precise market sizing data and demand forecasts are included, covering year-on-year (YoY) growth rates and compound annual growth rate (CAGR) projections, enabling businesses to plan for future growth.

2.5D and 3D IC Packaging Industry Supply Chain & Competitive Analysis
Using Porter’s Five Forces framework, the report assesses competitive intensity and profitability within the industry. A detailed supply chain analysis examines market participants, operational structures, and efficiency factors.

2.5D and 3D IC Packaging Segmentation & Growth Forecasts
The study systematically breaks down the Global 2.5D and 3D IC Packaging Market into multiple segments, outlining current conditions and future growth trajectories. This helps identify emerging trends and lucrative opportunities.

Regional Market Insights
The report offers country-wise assessments of market drivers, regulatory frameworks, and growth prospects across key regions:
• North America (United States, Canada, Mexico)
• Europe (Germany, France, United Kingdom, Russia)
• Asia-Pacific (China, India, Japan, South Korea, Australia)
• Rest of the World (Saudi Arabia, Brazil, Nigeria, South Africa)

Competitive Landscape & Key Player Profiles

Detailed evaluations of major companies include:
• Business overview & product offerings
• Financial performance & investment trends
• Recent mergers, acquisitions, and joint ventures (JVs)
• Strategic approaches adopted by market leaders

Executive Summary & Actionable Recommendations
A concise summary featuring charts, infographics, and forward-looking forecasts is provided. The report concludes with strategic recommendations to guide market stakeholders in decision-making.

Why Invest in This 2.5D and 3D IC Packaging Market Report?
✔️ Gain valuable insights into how COVID-19 has influenced the 2.5D and 3D IC Packaging market.
✔️ Discover market opportunities across key global regions.
✔️ Evaluate growth drivers & restraints and their long-term impact.
✔️ Access comprehensive market sizing & forecasting data.
✔️ Stay ahead of industry trends & competitive strategies.
✔️ Monitor M&A activities, partnerships, and joint ventures shaping the market.

For expert insights and customized segmentation, contact us to tailor the report to your specific business needs.

1 Market Overview

1.1 Product Overview and Scope of 2.5D and 3D IC Packaging

1.2 Global 2.5D and 3D IC Packaging Market Size and Forecast

1.3 China 2.5D and 3D IC Packaging Market Size and Forecast

1.4 China Market Percentage in Global

1.4.1 By Revenue, China 2.5D and 3D IC Packaging Share in Global Market, 2019-2030

1.4.2 2.5D and 3D IC Packaging Market Size: China VS Global, 2019-2030

1.5 2.5D and 3D IC Packaging Market Dynamics

1.5.1 2.5D and 3D IC Packaging Market Drivers

1.5.2 2.5D and 3D IC Packaging Market Restraints

1.5.3 2.5D and 3D IC Packaging Industry Trends

1.5.4 2.5D and 3D IC Packaging Industry Policy

2 Global Competitive Situation by Company

2.1 Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

2.2 Global 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

2.3 Global 2.5D and 3D IC Packaging Concentration Ratio

2.4 Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

2.5 Global 2.5D and 3D IC Packaging Manufacturers Product Type

3 China Competitive Situation by Company

3.1 China 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

3.2 China 2.5D and 3D IC Packaging 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

3.3 China 2.5D and 3D IC Packaging, Revenue Percentage of Local Players VS Foreign Manufacturers (2019-2024)

4 Industry Chain Analysis

4.1 2.5D and 3D IC Packaging Industry Chain

4.2 2.5D and 3D IC Packaging Upstream Analysis

4.3 2.5D and 3D IC Packaging Midstream Analysis

4.4 2.5D and 3D IC Packaging Downstream Analysis

5 Sights by Type

5.1 2.5D and 3D IC Packaging Classification

5.1.1 2.5D

5.1.2 3D TSV

5.1.3 3D Wafer-level Chip-scale Packaging

5.2 By Type, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

5.3 By Type, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

6 Sights by Application

6.1 2.5D and 3D IC Packaging Segment by Application

6.1.1 Consumer Electronics

6.1.2 Medical Devices

6.1.3 Communications and Telecom

6.1.4 Automotive

6.1.5 Other

6.2 By Application, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

6.3 By Application, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

7 Sales Sights by Region

7.1 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019 VS 2024 VS 2030

7.2 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

7.3 North America

7.3.1 North America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.3.2 By Country, North America 2.5D and 3D IC Packaging Market Size Market Share

7.4 Europe

7.4.1 Europe 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.4.2 By Country, Europe 2.5D and 3D IC Packaging Market Size Market Share

7.5 Asia Pacific

7.5.1 Asia Pacific 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.5.2 By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Market Size Market Share

7.6 South America

7.6.1 South America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.6.2 By Country, South America 2.5D and 3D IC Packaging Market Size Market Share

7.7 Middle East & Africa

8 Sights by Country Level

8.1 By Country, Global 2.5D and 3D IC Packaging Market Size & CAGR，2019 VS 2024 VS 2030

8.2 By Country, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3 U.S.

8.3.1 U.S. 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3.2 By Company, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.3.3 By Type, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.3.4 By Application, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4 Europe

8.4.1 Europe 2.5D and 3D IC Packaging Market Size, 2019-2030

8.4.2 By Company, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.4.3 By Type, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4.4 By Application, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5 China

8.5.1 China 2.5D and 3D IC Packaging Market Size, 2019-2030

8.5.2 By Company, China 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.5.3 By Type, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5.4 By Application, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6 Japan

8.6.1 Japan 2.5D and 3D IC Packaging Market Size, 2019-2030

8.6.2 By Company, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.6.3 By Type, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6.4 By Application, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7 South Korea

8.7.1 South Korea 2.5D and 3D IC Packaging Market Size, 2019-2030

8.7.2 By Company, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.7.3 By Type, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7.4 By Application, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8 Southeast Asia

8.8.1 Southeast Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.8.2 By Company, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.8.3 By Type, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8.4 By Application, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9 India

8.9.1 India 2.5D and 3D IC Packaging Market Size, 2019-2030

8.9.2 By Company, India 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.9.3 By Type, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9.4 By Application, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10 Middle East & Asia

8.10.1 Middle East & Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.10.2 By Company, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.10.3 By Type, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10.4 By Application, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

9 Global Manufacturers Profile

9.1 ASE Technology

9.1.1 ASE Technology Company Information, Head Office, Market Area and Industry Position

9.1.2 ASE Technology Company Profile and Main Business

9.1.3 ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.1.5 ASE Technology Recent Developments

9.2 Samsung Electronics

9.2.1 Samsung Electronics Company Information, Head Office, Market Area and Industry Position

9.2.2 Samsung Electronics Company Profile and Main Business

9.2.3 Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.2.5 Samsung Electronics Recent Developments

9.3 Toshiba

9.3.1 Toshiba Company Information, Head Office, Market Area and Industry Position

9.3.2 Toshiba Company Profile and Main Business

9.3.3 Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application

9.3.4 Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.3.5 Toshiba Recent Developments

9.4 STMicroelectronics

9.4.1 STMicroelectronics Company Information, Head Office, Market Area and Industry Position

9.4.2 STMicroelectronics Company Profile and Main Business

9.4.3 STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.4.5 STMicroelectronics Recent Developments

9.5 Xilinx

9.5.1 Xilinx Company Information, Head Office, Market Area and Industry Position

9.5.2 Xilinx Company Profile and Main Business

9.5.3 Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application

9.5.4 Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.5.5 Xilinx Recent Developments

9.6 Intel

9.6.1 Intel Company Information, Head Office, Market Area and Industry Position

9.6.2 Intel Company Profile and Main Business

9.6.3 Intel 2.5D and 3D IC Packaging Models, Specifications and Application

9.6.4 Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.6.5 Intel Recent Developments

9.7 Micron Technology

9.7.1 Micron Technology Company Information, Head Office, Market Area and Industry Position

9.7.2 Micron Technology Company Profile and Main Business

9.7.3 Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.7.5 Micron Technology Recent Developments

9.8 TSMC

9.8.1 TSMC Company Information, Head Office, Market Area and Industry Position

9.8.2 TSMC Company Profile and Main Business

9.8.3 TSMC 2.5D and 3D IC Packaging Models, Specifications and Application

9.8.4 TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.8.5 TSMC Recent Developments

9.9 SK Hynix

9.9.1 SK Hynix Company Information, Head Office, Market Area and Industry Position

9.9.2 SK Hynix Company Profile and Main Business

9.9.3 SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application

9.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.9.5 SK Hynix Recent Developments

9.10 Amkor Technology

9.10.1 Amkor Technology Company Information, Head Office, Market Area and Industry Position

9.10.2 Amkor Technology Company Profile and Main Business

9.10.3 Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.10.5 Amkor Technology Recent Developments

9.11 GlobalFoundries

9.11.1 GlobalFoundries Company Information, Head Office, Market Area and Industry Position

9.11.2 GlobalFoundries Company Profile and Main Business

9.11.3 GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application

9.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.11.5 GlobalFoundries Recent Developments

9.12 SanDisk (Western Digital)

9.12.1 SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

9.12.2 SanDisk (Western Digital) Company Profile and Main Business

9.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application

9.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.12.5 SanDisk (Western Digital) Recent Developments

9.13 Synopsys

9.13.1 Synopsys Company Information, Head Office, Market Area and Industry Position

9.13.2 Synopsys Company Profile and Main Business

9.13.3 Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application

9.13.4 Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.13.5 Synopsys Recent Developments

9.14 Invensas

9.14.1 Invensas Company Information, Head Office, Market Area and Industry Position

9.14.2 Invensas Company Profile and Main Business

9.14.3 Invensas 2.5D and 3D IC Packaging Models, Specifications and Application

9.14.4 Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.14.5 Invensas Recent Developments

9.15 Siliconware Precision Industries

9.15.1 Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

9.15.2 Siliconware Precision Industries Company Profile and Main Business

9.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application

9.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.15.5 Siliconware Precision Industries Recent Developments

9.16 Jiangsu Changjiang Electronics

9.16.1 Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

9.16.2 Jiangsu Changjiang Electronics Company Profile and Main Business

9.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.16.5 Jiangsu Changjiang Electronics Recent Developments

9.17 Powertech Technology

9.17.1 Powertech Technology Company Information, Head Office, Market Area and Industry Position

9.17.2 Powertech Technology Company Profile and Main Business

9.17.3 Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.17.5 Powertech Technology Recent Developments

10 Conclusion

11 Appendix

11.1 Research Methodology

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Market Estimation Model

11.4 Disclaimer

Tables & Figures:

Table 1. 2.5D and 3D IC Packaging Market Size & CAGR: China VS Global, (US$ Million), 2019-2030

Table 2. 2.5D and 3D IC Packaging Market Restraints

Table 3. 2.5D and 3D IC Packaging Market Trends

Table 4. 2.5D and 3D IC Packaging Industry Policy

Table 5. Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024) & (US$ million)

Table 6. Global 2.5D and 3D IC Packaging Revenue Market Share by Company (2019-2024)

Table 7. Global 2.5D and 3D IC Packaging Manufacturers Market Concentration Ratio (CR3 and HHI)

Table 8. Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

Table 9. Global 2.5D and 3D IC Packaging Manufacturers Product Type

Table 10. China 2.5D and 3D IC Packaging Revenue by Company (2019-2024) & (US$ million)

Table 11. China 2.5D and 3D IC Packaging Revenue Market Share by Company (2019-2024)

Table 12. Global Key Players of 2.5D and 3D IC Packaging Upstream (Raw Materials)

Table 13. Global 2.5D and 3D IC Packaging Typical Customers

Table 14. 2.5D and 3D IC Packaging Typical Distributors

Table 15. By Type, Global 2.5D and 3D IC Packaging Revenue & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 16. By Application, Global 2.5D and 3D IC Packaging Revenue & CAGR, 2019 VS 2024 VS 2030, US$ Million

Table 17. By Region, Global 2.5D and 3D IC Packaging Market Size, 2019 VS 2024 VS 2030, US$ Million

Table 18. By Region, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Table 19. By Country, Global 2.5D and 3D IC Packaging Revenue & CAGR，2019 VS 2024 VS 2030, US$ Million

Table 20. By Country, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Table 21. By Country, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Table 22. ASE Technology Company Information, Head Office, Market Area and Industry Position

Table 23. ASE Technology Company Profile and Main Business

Table 24. ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 25. ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 26. ASE Technology Recent Developments

Table 27. Samsung Electronics Company Information, Head Office, Market Area and Industry Position

Table 28. Samsung Electronics Company Profile and Main Business

Table 29. Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 30. Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 31. Samsung Electronics Recent Developments

Table 32. Toshiba Company Information, Head Office, Market Area and Industry Position

Table 33. Toshiba Company Profile and Main Business

Table 34. Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application

Table 35. Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 36. Toshiba Recent Developments

Table 37. STMicroelectronics Company Information, Head Office, Market Area and Industry Position

Table 38. STMicroelectronics Company Profile and Main Business

Table 39. STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 40. STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 41. STMicroelectronics Recent Developments

Table 42. Xilinx Company Information, Head Office, Market Area and Industry Position

Table 43. Xilinx Company Profile and Main Business

Table 44. Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application

Table 45. Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 46. Xilinx Recent Developments

Table 47. Intel Company Information, Head Office, Market Area and Industry Position

Table 48. Intel Company Profile and Main Business

Table 49. Intel 2.5D and 3D IC Packaging Models, Specifications and Application

Table 50. Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 51. Intel Recent Developments

Table 52. Micron Technology Company Information, Head Office, Market Area and Industry Position

Table 53. Micron Technology Company Profile and Main Business

Table 54. Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 55. Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 56. Micron Technology Recent Developments

Table 57. TSMC Company Information, Head Office, Market Area and Industry Position

Table 58. TSMC Company Profile and Main Business

Table 59. TSMC 2.5D and 3D IC Packaging Models, Specifications and Application

Table 60. TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 61. TSMC Recent Developments

Table 62. SK Hynix Company Information, Head Office, Market Area and Industry Position

Table 63. SK Hynix Company Profile and Main Business

Table 64. SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application

Table 65. SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 66. SK Hynix Recent Developments

Table 67. Amkor Technology Company Information, Head Office, Market Area and Industry Position

Table 68. Amkor Technology Company Profile and Main Business

Table 69. Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 70. Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 71. Amkor Technology Recent Developments

Table 72. GlobalFoundries Company Information, Head Office, Market Area and Industry Position

Table 73. GlobalFoundries Company Profile and Main Business

Table 74. GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application

Table 75. GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 76. GlobalFoundries Recent Developments

Table 77. SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

Table 78. SanDisk (Western Digital) Company Profile and Main Business

Table 79. SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application

Table 80. SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 81. SanDisk (Western Digital) Recent Developments

Table 82. Synopsys Company Information, Head Office, Market Area and Industry Position

Table 83. Synopsys Company Profile and Main Business

Table 84. Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application

Table 85. Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 86. Synopsys Recent Developments

Table 87. Invensas Company Information, Head Office, Market Area and Industry Position

Table 88. Invensas Company Profile and Main Business

Table 89. Invensas 2.5D and 3D IC Packaging Models, Specifications and Application

Table 90. Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 91. Invensas Recent Developments

Table 92. Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

Table 93. Siliconware Precision Industries Company Profile and Main Business

Table 94. Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application

Table 95. Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 96. Siliconware Precision Industries Recent Developments

Table 97. Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

Table 98. Jiangsu Changjiang Electronics Company Profile and Main Business

Table 99. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

Table 100. Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 101. Jiangsu Changjiang Electronics Recent Developments

Table 102. Powertech Technology Company Information, Head Office, Market Area and Industry Position

Table 103. Powertech Technology Company Profile and Main Business

Table 104. Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application

Table 105. Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

Table 106. Powertech Technology Recent Developments

List of Figure

Figure 1. 2.5D and 3D IC Packaging Picture

Figure 2. Global 2.5D and 3D IC Packaging Industry Market Size and Forecast (US$ million) & (2019-2030)

Figure 3. China 2.5D and 3D IC Packaging Revenue and Forecast (US$ million) & (2019-2030)

Figure 4. 2019-2030 China 2.5D and 3D IC Packaging Market Share of Global

Figure 5. Global 2.5D and 3D IC Packaging Key Participants, Market Share, 2021 VS 2022 VS 2023

Figure 6. Global 2.5D and 3D IC Packaging Market Share by Company, (Tier 1, Tier 2 and Tier 3), 2019-2024

Figure 7. China 2.5D and 3D IC Packaging Key Participants, Market Share, 2021 VS 2022 VS 2023

Figure 8. China 2.5D and 3D IC Packaging Revenue, Domestic VS Import Products, Proportion of China Local Players and Foreign Players, 2019-2024

Figure 9. 2.5D and 3D IC Packaging Industry Chain

Figure 10. 2.5D

Figure 11. 3D TSV

Figure 12. 3D Wafer-level Chip-scale Packaging

Figure 13. By Type, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Figure 14. By Type, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 15. Consumer Electronics

Figure 16. Medical Devices

Figure 17. Communications and Telecom

Figure 18. Automotive

Figure 19. Other

Figure 20. By Application, Global 2.5D and 3D IC Packaging Revenue, 2019-2030, US$ Million

Figure 21. By Application, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 22. By Region, Global 2.5D and 3D IC Packaging Revenue Market Share, 2019-2030

Figure 23. North America 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 24. By Country, North America 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 25. Europe 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 26. By Country, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 27. Asia Pacific 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 28. By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 29. South America 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 30. By Country, South America 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

Figure 31. Middle East & Africa 2.5D and 3D IC Packaging Revenue & Forecasts, 2019-2030, US$ Million

Figure 32. U.S. 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 33. By Company, U.S. 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 34. By Type, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 35. By Application, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 36. Europe 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 37. By Company, Europe 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 38. By Type, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 39. By Application, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 40. China 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 41. By Company, China 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 42. By Type, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 43. By Application, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 44. Japan 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 45. By Company, Japan 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 46. By Type, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 47. By Application, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 48. South Korea 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 49. By Company, South Korea 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 50. By Type, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 51. By Application, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 52. Southeast Asia 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 53. By Company, Southeast Asia 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 54. By Type, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 55. By Application, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 56. India 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 57. By Company, India 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 58. By Type, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 59. By Application, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 60. Middle East & Asia 2.5D and 3D IC Packaging Revenue, 2019-2030, (US$ Million)

Figure 61. By Company, Middle East & Asia 2.5D and 3D IC Packaging Market Share, 2019-2024

Figure 62. By Type, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 63. By Application, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

Figure 64. Research Methodology

Figure 65. Breakdown of Primary Interviews

Figure 66. Bottom-up Approaches

Figure 67. Top-down Approaches

Research Methodology:

This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.

2.5D and 3D IC Packaging Market Size Estimation

To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.

Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.

Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.

We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.

Data Source

Secondary Sources

This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.

These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.

Market Size	Segmental value Geographic Penetration Product Adoption Rate for Different market	Journals, Websites, and Press Releases Annual Reports and SEC Filings Company Websites and Press Releases Public and Paid Databases Ample Market Reports Data Repository
Market Position of Top Company	Product Financials Geographic value Mix Total Company value Business/Segmental value Mix
Qualitative Analysis	Influence Factors Market Potential Market Risks and Opportunities Industry Trends Geographical Features Government Policies	Company Websites and Press Releases Public and Paid Databases Annual Reports Industry Associations Ample Market Reports Data Repository

Primary Sources

As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.

On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.

These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.

Key Data Information from Primary Sources

Primary Sources	Parameters	Key Data
Market Segments(by Application, by Type)	Value by Type Status and Forecast Value by Application Value by Regions, Status and Forecast (2025-2031)	Value Market Share by Type Value Growth Rate by Type Value by Application Percentage and Growth Rate by Application Value Growth Rate and Market Share by Regions Market Size Status and Forecast (2025-2031)
Total Market	Overall Size, Status and Forecast	Market Size Status and Forecast (2025-2031)

Frequently asked questions(FAQ's):

Why is the 2.5D and 3D IC Packaging Market trending toward high growth trajectories?

A dynamic process in the 2.5D and 3D IC Packaging Market is initiated by new entrants, including competitors from unrelated industries, in addition to the established players like TSMC, Intel, Samsung, ASE, Amkor, etc..

How are players chosen for the research coverage of the 2.5D and 3D IC Packaging Market study?

MI used a variety of industry standards such as NAICS, ICB, TRIC, and others to identify functional players in the industry, which they then shortlist and validate in an iterative process to finalize the most relevant players.

What important business segments are segregated by application types in the latest edition of the 2.5D and 3D IC Packaging Market?

The key business segments in the 2.5D and 3D IC Packaging Market are segregated by applications [AI Chips, High-Performance Computing, Automotive Electronics, IoT] and types [2.5D Stacked, 3D-IC, Hybrid Bonding, Fan-Out].

What is the size of the 2.5D and 3D IC Packaging Industry?

According to the report, the 2.5D and 3D IC Packaging Industry will grow to USD XXX Million by 2030, with a YY% CAGR.

Where does the 2.5D and 3D IC Packaging Industry stands in terms of scaling end-use implementations?

According to the 2.5D and 3D IC Packaging Market research paper, organizations are making more progress than their supply chain counterparts, including suppliers.

Who should consider the 2.5D and 3D IC Packaging Market study?

The 2.5D and 3D IC Packaging Industry stakeholders, executives, and experts, as well as individuals who need to develop consumer-friendly strategies and use technology to stay ahead of the competition.

Global 2.5D and 3D IC Packaging Industry Research & Trends Analysis Report

Global 2.5D and 3D IC Packaging Industry Research & Trends Analysis Report

Tables & Figures:

Research Methodology:

2.5D and 3D IC Packaging Market Size Estimation

Data Source

Frequently asked questions(FAQ's):

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